Whether the package stray capacity (RLC due to patterns in the IC package, wire bonding, etc.) is included in the unencrypted SPICE model?
IF not, Is it possible to share the stray capacity as a format of RLC or SPICE/S parameter?
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Whether the package stray capacity (RLC due to patterns in the IC package, wire bonding, etc.) is included in the unencrypted SPICE model?
IF not, Is it possible to share the stray capacity as a format of RLC or SPICE/S parameter?
HI
it is not included in Spice model, Can you send me a Email to daniel-li@ti.com, I can check internally.
Thanks