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CSD18542KTT: RθJC

Masakazu Adachi

Intellectual 2500 points

Part Number: CSD18542KTT

Hello team,

I have a question.

What conditions did you use to measure RθJC? I don't know what kind of substrate and heat sink you used like other FETs, so please let me know.

Regards,

Masa

over 2 years ago

0 John Wallace1 over 2 years ago

TI__Mastermind 34005 points

Hello Masa-san,

Thanks for the inquiry. Thermal resistance testing for our D2PAK and TO220 packages is done with the FET attached to a heatsink. I am trying to get more details on the heatsink used for the testing. Unlike other SMT packages, thermal testing is not done with the D2PAK device PCB mounted. Please go to the link below for more information on how TI tests and specs thermal resistance in the datasheet. I'll update you when I have more information.

http://e2e.ti.com/blogs_/b/powerhouse/archive/2016/06/10/understanding-mosfet-data-sheets-part-6-thermal-impedance

Best Regards,

John Wallace

TI FET Applications

+1 John Wallace1 over 2 years ago in reply to John Wallace1

TI__Mastermind 34005 points

Hello Masa-san,

Following up to see if your issue has been resolved. Please let me know if I can be of any further assistance.

Best Regards,

John

0 Masakazu Adachi over 2 years ago in reply to John Wallace1

TI__Intellectual 2500 points

Hello John-san,

I understand that RθJA was measured while floating in air, but what kind of heat sink was used for RθJC?

Regards,

Masa

+1 Chris Bull over 2 years ago in reply to Masakazu Adachi

TI__Expert 7445 points

Masa san,

The heatsink used is similar to the link below:

https://www.mouser.com/ProductDetail/Aavid/576012B00000G?qs=rBx5S%2FKsFjxkQBd%2FBWXVJQ%3D%3D

Thanks

Chris

0 Masakazu Adachi over 2 years ago in reply to Chris Bull

TI__Intellectual 2500 points

Hello Chris-san,

Thanks. I understand.

Regards,

Masa