Hello team,
I have a question.
What conditions did you use to measure RθJC? I don't know what kind of substrate and heat sink you used like other FETs, so please let me know.
Regards,
Masa
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Hello team,
I have a question.
What conditions did you use to measure RθJC? I don't know what kind of substrate and heat sink you used like other FETs, so please let me know.
Regards,
Masa
Hello Masa-san,
Thanks for the inquiry. Thermal resistance testing for our D2PAK and TO220 packages is done with the FET attached to a heatsink. I am trying to get more details on the heatsink used for the testing. Unlike other SMT packages, thermal testing is not done with the D2PAK device PCB mounted. Please go to the link below for more information on how TI tests and specs thermal resistance in the datasheet. I'll update you when I have more information.
http://e2e.ti.com/blogs_/b/powerhouse/archive/2016/06/10/understanding-mosfet-data-sheets-part-6-thermal-impedance
Best Regards,
John Wallace
TI FET Applications
Hello Masa-san,
Following up to see if your issue has been resolved. Please let me know if I can be of any further assistance.
Best Regards,
John
Hello John-san,
I understand that RθJA was measured while floating in air, but what kind of heat sink was used for RθJC?
Regards,
Masa
Masa san,
The heatsink used is similar to the link below:
https://www.mouser.com/ProductDetail/Aavid/576012B00000G?qs=rBx5S%2FKsFjxkQBd%2FBWXVJQ%3D%3D
Thanks
Chris