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TPS2012A: D

Austin Schultz
Prodigy 110 points
Part Number: TPS2012A

Hello,

Query from a customer who noticed changes to wire bonding processes/wafer on TI part TPS2012AD noted around 2005 DCs.  I found that the data sheet posted was revised in 2007, but don’t know what the parametrics were like before this change, so I have nothing to compare to.  Requester notes that individual fabricators had issued PCN/PDN during this time with adjustments.  I only see that on the notes on the bottom of pages 26-31 of the data sheet, it mentions that some metrics come down to individual fabricators, but I don’t believe that’s enough to substantiate a difference in the process.

Can you advise what changes were made in the revision of the data sheet in 2007 and if any of those were related to the wire bonding process on this part or the die map?

Thank you

  • 0
    TI__Genius 13300 points

    Hello Austin,

    Allow me some time to reach out to our backend team to see if there's information regarding this. Since this is much older and was done well before our revision tracking program was implemented it may not be possible to recover this information. I will get back to you by EOD 12/16.

    Regards,

    Kalin Burnside

  • 0 in reply to Kalin Burnside
    Prodigy 110 points

    Hi Kalin,

    I am still awaiting response.  Just wanted to bring this back to your attention!

  • 0 in reply to Austin Schultz
    TI__Genius 13300 points

    Hello Austin,

    I apologize for the delay in response. We do not have the ability to look up specific datasheet revisions before 2010. If there wasn't a PCN for the datasheet changes specifically then it probably did not require a PCN. It would not be related to the 2005 PCN because the revision would have occurred immediately.

    regards,

    Kalin Burnside

  • 0 in reply to Kalin Burnside
    TI__Genius 13300 points

    Hello Austin,

    I was actually able to find old revisions of the datasheet. The only changes between the original version from 1999 and 2006 was adding in which devices the RDSON values were attributed to (the original version did not specify which device each RDSON specification was for, so they corrected this). They also added in the mechanical drawings at the end of the document and included information about different applications. It had nothing to do with the PCN from 2005.

    Regards,

    Kalin Burnside