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CSD18532Q5B: Thermal Characteristics

Part Number: CSD18532Q5B
Other Parts Discussed in Thread: CSD19502Q5B

Hi Team, seeking thermal information.

CSD18532Q5B

CSD19502Q5B

CSD96497Q5MCT

Thank you.

-Mark

  • Hello Mark,

    Thanks for the inquiry. Max thermal resistance, Rθjc(bottom) = 0.8°C/W, junction-to-case, and Rθja = 50°C/W, junction-to-ambient, is specified in Table 5.2 of the FET datasheets. The estimated thermal resistance thru the top of the package, Rθjc(top) is ~9°C/W for both devices. The CSD96497Q5MCT power stage is part of a different product line. I will reassign this thread to the power stage applications team. Please let me know if you need any additional information.

    Best Regards,

    John Wallace

    TI FET Applications

  • Hi Mark,

    For the CSD96497Q5MCT, the typical thermal resistance, junction-to-case Rθjc (Top) = 5.8°C/W, junction-to-board Rθjb = 1°C/W, Ψjt = 0.2 °C/W.

    Best,

    Ryan