Hello Tea,m,
Postingg on behlf of my customer:
The TPS63811 datasheet shows a Rthj-a (Junction-to-ambient thermal resistance) = 80.5ºC/W
I already read the Semiconductor and IC Package Thermal Metrics application report and I have come to the conclusion that this feature (thermal resistance) can be improved because the heat dissipation conditions of my board can be better than those used in the tes: my board can have 4 layers, large copper planes, dissipative vias, etc. Do you think that it is certainly possible to achieve a thermal resistance of the order of 50 - 60 ºC/W through optimization in the PCB design? I do not want to spend a lot of work time and money if you consider that it is highly difficult to reach such a level of improvement with respect to what is indicated in the datasheet.
Thank you very much for your help
Kind Regards,
Renan
