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TPS62816-Q1: maximum pressure on top side

Lijia Zhu
Expert 5280 points
Part Number: TPS62816-Q1

Hi Team,

My customer wants to cool the chip by a cooling platform. However, due to processing errors, there may be stress on the chip. Could you check internally and provide the maximum pressure value this chip can survive?

B&R

Lijia

  • 0
    TI__Expert 5425 points

    Hi Lijia,

    unfortunately this package has not been designed for the use case described, so this type of data is not available. So I can just suggest to keep the mechanical stress as low as possible. 

    Please also keep in mind that the cooling through the top will not be very efficient as you can see in the thermal characteristics data in the datasheet. 

    Anyway I try to find some generic information which may help you. I will get back to you tomorrow.

    Best regards,

    Juergen

  • 0 in reply to Juergen
    TI__Expert 5280 points

    Hi Juergen,

    thanks! Please keep me updated!

    B&R

    Lijia

  • 0 in reply to Lijia Zhu
    TI__Expert 5425 points

    Hi Lijia,

    there is another post here in this forum suggesting maximum 500N. Test apparatus according to JESD22-B119 recommends stress capabilities in the range of 1000N to 5000N. Those numbers appear very high to me an I even would be worried more about damages caused by bending the PCB. The test setup described in the JESD shows means to avoid or limit the bending of the PCB, so I think this will be the limiting factor for the mechanical design.

    I hope this helps or at least gives some guidance. 

    Best regards,

    Juergen