Because of the Thanksgiving holiday in the U.S., TI E2E™ design support forum responses may be delayed from November 25 through December 2. Thank you for your patience.

  • State
  • Locked Locked
  • Replies 1 reply
  • Subscribers 65 subscribers
  • Views 100 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS25981: TPS25981 thermal prediction

Randy Chen
Intellectual 1810 points
Part Number: TPS25981
Other Parts Discussed in Thread: TPS25982,

Hi, 

Customer is wondering why that small package chip (TPS25981) ΨJT is lower than the bigger package chip (TPS25982)? 2.1 C/W vs. 3 C/W : 2x2mm vs. 4x4mm.

How to predict that thermal result if 9A(Vin 12V) current pass thru, 8layer PCB, 50'C.

TPS25981 thermal information:

TPS25982 thermal information:

Best regards,

Randy 

  • 0
    TI__Guru 62375 points

    Hi Randy,

    To predict rise in junction temp RQJA is important. TJ= TA+ (PD*RQJA). RQJA for 8 layer pcb with vias and good amount of copper should be close to the datasheet value for custom pcb.

    PD-> power dissipation across eFuse

    Regards

    Kunal Goel