Hi,
we are updating a legacy design where the GND connection of the TLC59283 (pin 22 in the QFN-24 package) is being filtered (probably for EMI reasons). In that design the thermal pad is connected to the same net, which means the thermal mass attached to it is much lower than it could be if it were attached to the regular GND plane. The datasheet suggests that this is possible: "Thermal pad is not connected to GND internally". However, the note continues: "The thermal pad must be connected to GND via the printed circuit board (PCB) pattern." I take it this is actually meant to say "The thermal pad must be connected to a plane" rather than implying any kind of electrical constraint.
Would it be permissible to connect the EP to the GND plane while continuing to filter the GND pin?
Thanks!
