CSD87330Q3D: CSD87330Q3D

Hello Udesh,

Thanks for your interest in TI FETs. The CSD87330Q3D datasheet includes thermal resistance values, RθJA, RθJC to top of package and RθJC to GND pad on bottom of package in Table 5.3 on page 3 and maximum power dissipation in Table 5.1 on the same page. In Section 6, Application & Information portion of the datasheet, you will find instructions on how to use the datasheet curves to estimate power loss based on your operating conditions. You can also estimate the power loss for your application using the Excel-based sync buck FET selection tool at the link below. If you have any difficulty, please respond to me with your application requirements and I will assist you with your power dissipation estimate.

https://www.ti.com/tool/SYNC-BUCK-FET-LOSS-CALC

Best Regards,

John Wallace

TI FET Applications

Hi Udesh,

Thanks again for your interest in TI FETs. The CSD87330Q3D maximum junction temperature is 150°C as specified in Table 5.1 in the datasheet. Similarly, the maximum recommended operating junction temperature is 125°C as shown in Table 5.2 in the datasheet. The actual performance in the application is dependent upon the PCB layout and stackup as well as thermal environment including ambient temperature and airflow. As a general rule of thumb, this package is capable of about 2.1W maximum power dissipation. I am including links below to more information on thermal impedance, maximum power dissipation and safe operating area for TI MOSFET products.

Best Regards,

John

https://e2e.ti.com/blogs_/b/powerhouse/posts/understanding-mosfet-data-sheets-part-6-thermal-impedance

https://e2e.ti.com/blogs_/b/powerhouse/posts/selecting-the-right-power-mosfet-power-block-package-for-your-application

https://e2e.ti.com/blogs_/b/powerhouse/posts/choosing-the-right-soa-for-your-design-discrete-fets-vs-power-blocks