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TLV760: Graph of Psi-JT vs "PCB copper coverage"

Motoyasu Hattori
Expert 8675 points
Part Number: TLV760

Hi,

Could you please make the graph of Psi-JT vs "PCB copper coverage are such as Vdd/GND Size"?

The result of thermal on Package top is different from calculation with Psi-JT.   My customer is thinking Thermal pad size such as Vdd/GND size is different from pad size of Psi measurement.  So they request us to make this graph of simulation or actual result.

Also, are there TLV760 version of PCB thermal calculator?  Please advise us.

Thanks and best regards,
M.HATTORI.

  • 0
    TI__Mastermind 37965 points

    Hi Hattori-san,

    It sounds like they might be using the thermal metrics incorrectly. The Psi parameters are not to be used to calculate the top of package temperature. They are to be used to calculate the junction temperature after measuring the top of package temperature. 

    The thermal metrics in the datasheet are simulated following the JEDEC standard JESD51-7. The thermal performance they get in their application is dependent on the layout. With that said, the Psi parameters are defined in a way that results in them being largely layout-independent; they just need to understand how to use them correctly. 

    Can you share the schematic and layout of the LDO? I can try to help evaluate their application before submitting for a thermal model. 

    Thanks,

    Nick