Other Parts Discussed in Thread: TPSM82866A,
Hello,
My customer is trying to find info on how to cool this unpackaged component.
Can it be cooled by a traditional touch off?
How much pressure can this device withstand?
Thanks,
Adam
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Hello,
My customer is trying to find info on how to cool this unpackaged component.
Can it be cooled by a traditional touch off?
How much pressure can this device withstand?
Thanks,
Adam
Hi Adam,
Can you explain what 'traditional touch off' is?
We don't specify a pressure.
As well, the TPSM82866A would be recommended. It is smaller and has better thermal performance. It is also in a normal overmolded package.
Thanks,
Chris
Hi Chris,
What the customer meant by a traditional touch off is a an extruded piece of metal touching the top of the device with a Thermal Interface Material sandwiched in between.
What precautions should they take with TPSM82480MOPR since its not in a “normal overmolded package”?
Thanks,
Adam
Thanks for clarifying.
Why do they want to use the TPSM82480 instead of the TPSM82866A? Maybe you can send the customer details and application to me over email.
The inductors on the TPSM82480 are exposed, so any contacting metal would short their terminals. The heat sink would then be confined to the area of the IC, with little/no overflow allowed (or else it might short the inductors). The x-y of the TPSM82866A is larger than the x-y of the IC used on TPSM82480, so that allows for a bigger connection point without nearby inductors to short.
Chris