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REG71050: REG71050 VS TPS60150 heat dissipation

Part Number: REG71050
Other Parts Discussed in Thread: TPS60150,

Hi TI Team,

I am looking to boost a 3V3 rail to 5V in order to power a load of max 30mA. The PCB will be fitted into an enclosure with temperature sensor.

 I would like to ask which solution out of the following two will create the least heat dissipation which will have a result of a less heat rise building inside the enclosure.

 REG71050 or TPS60150.

 Thank you.

  • Hello Kostas,

    Both are charge pumps. For getting from 3.3V to 5V, a charge pump operates in voltage doubler mode. So at the end, the power dissipation in this operating mode is calculated like this and it is the same for both devices:

    ( 2 * 3.3V - 5V) * 30 mA = 48 mW

    So if you want to minimize power dissipation, you either need to use a free running voltage doubler, which then generates a voltage which is above 6V with 3.3V input or you go with a inductive boost converter optimized for low currents.

    Best regards,
    Brigitte

  • Hi Brigitte,
    Thanks for your prompt response. 

    Would you be able to recommend any TI inductive boost converter optimized for low currents to match my power requirements?

    Kind Regards,
    Kostas

  • Hi Kostas,

    Thanks for your response. Please give us time. We will be back with an answer at the beginning of next week.

    Kind regards,

    Moritz

  • Hi Moritz and Brigitte,

    Both 
    REG71050 or TPS60150 come on WSON(6) package. 
    According to their datasheets the REG71050 Junction-to-ambient thermal resistance is 119.1 °C/W whereas the TPS60150 is  69.1°C/W.

    Can you confirm that the TPS60150 will run cooler based on 30mA load (48mW power dissipation)?
    Thanks.

  • Hello Kostas,

    This is what I would expect.

    Best regards,
    Brigitte