TPSM82823: Thermal resistance

Hello JH,

Thank you for reaching out,

The thermal performance also depends upon the type of package as well.

JH Shin said:

Is the thermal resistance information in the TPSM82823 datasheet correct?

Yes, those values are correct the one with left column are with JEDEC and one with right column is with EVM.

JH Shin said:

Will the customer have no problems with heat when using this product instead of the TPS82085 in the same environment?

The reason for the low thermal resistance for TPS82085 is due to the exposed thermal pad.

As far as the device Junction temperature is in between -40 to 125°C there should not be any concern.

Thank you & regards,

Moheddin.

Hi Moheddin,

Thanks for your help.

If the customer deems necessary, may a thermal pad be applied to the top of the module when using the power module below?

 - TPSM82823

 - TPSM82864A

 - TPSM82810

 - TPSM82813

Thanks,

JH

Hello JH,

JH Shin said:

If the customer deems necessary, may a thermal pad be applied to the top of the module when using the power module below?

We see some customer's do this, but TI does not evaluated this or does not guaranty, It up to customer risk.

Thank you & regards,

Moheddin.