Hello,
In the Datasheet there is a recommendation to place some vias under the IC to route the SW node with the inductor.
If I check the Board Layout I see that there are 8 vias under the IC for this purpose and also 3 extra vias for GND.
What is the size of those vias (drill + pad) so the board is manufacturable without being so expensive?
What is the correct number of vias to be placed related to their drill size? (in case a must use a different via size than TI's)
Could you please share the size of the power vias ?
Is it mandator to route a copy of the Top Power Plane on the bottom side? My board will use 2A
How many vias should I place and which size should they be?
Thank you
