TLV740P: Solderability test condition of TLV74033PDBVR

Kenta Yajima

Prodigy 170 points

Part Number: TLV740P

I'd like to knoe what is the test condition of TLV74033PDBVR for Solderability.

I expect that this is based on "J-STD-002".

Is this right? If so, could you please clrify detail test condition of "J-STD-002"?

over 1 year ago

0 John Schneider over 1 year ago

TI__Genius 12511 points

Hi Kenta,

This is a list of recommended soldering profiles. The JEDEC standard we do adhere to and this device is passed.

Here is additional recommended soldering profiles for this device

https://www.ti.com/lit/an/snoa292j/snoa292j.pdf?ts=1690568388903&ref_url=https%253A%252F%252Fwww.google.com%252F

Regards,

John

0 Kenta Yajima over 1 year ago in reply to John Schneider

TI__Prodigy 170 points

Thanks for your comments

I understand that TLV74033PDBVR passed J-STD-002 but could you please show me the test condition of this?

0 John Schneider over 1 year ago in reply to Kenta Yajima

TI__Genius 12511 points

Hi Kenta,

I've asked for the JEDEC conditions as the JEDEC conditions are not public information. I will get back to you with what we can share about the testing conditons.

Regards,

John

0 John Schneider over 1 year ago in reply to John Schneider

TI__Genius 12511 points

Hi Kenta,

Because JEDEC is a paid for document I am unable to give the exact conditions, however I spoke iwth the experts and they were able to give a small subsection to focus on Test S1 in the document.

"Our solderability test specification QSS 009-130 follows the J-STD-002. We qualify new products using the lead free surface mount solderability test,
which is the Testmethod ‘Test S1’ in J-STD-002."

Regards,

John

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TLV740P: Solderability test condition of TLV74033PDBVR