I'd like to knoe what is the test condition of TLV74033PDBVR for Solderability.
I expect that this is based on "J-STD-002".
Is this right? If so, could you please clrify detail test condition of "J-STD-002"?
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I'd like to knoe what is the test condition of TLV74033PDBVR for Solderability.
I expect that this is based on "J-STD-002".
Is this right? If so, could you please clrify detail test condition of "J-STD-002"?
Hi Kenta,
This is a list of recommended soldering profiles. The JEDEC standard we do adhere to and this device is passed.
Here is additional recommended soldering profiles for this device
Regards,
John
Thanks for your comments
I understand that TLV74033PDBVR passed J-STD-002 but could you please show me the test condition of this?
Hi Kenta,
I've asked for the JEDEC conditions as the JEDEC conditions are not public information. I will get back to you with what we can share about the testing conditons.
Regards,
John
Hi Kenta,
Because JEDEC is a paid for document I am unable to give the exact conditions, however I spoke iwth the experts and they were able to give a small subsection to focus on Test S1 in the document.
"Our solderability test specification QSS 009-130 follows the J-STD-002. We qualify new products using the lead free surface mount solderability test,
which is the Testmethod ‘Test S1’ in J-STD-002."
Regards,
John