Hi Team, I hope you are doing good. A customer bought 330 pieces from us and wanted to complain about poor quality of solderability. They quote the following,
--------------
We request that you forward this to the manufacturer TI for their attention:All components used so far show poor solderability.exhibit.Our technology describes the defect as follows:We assume that the matte layer on the side of the pin(the lower of the two layers to be detected) of the IC leads to a worse wetting of the pin side.The error pattern here is always a bad looking side miniscus(lateral connection of pin to PCB).Whether the layer is due to oxidation or another residue cannot be residue, cannot be judged. From experience, we can say that these components have always looked always looked not optimal and the mentioned layer could be the cause layer could be the cause, photos attached.A rework of our side is normally not necessary, because the necessary, because the solder joints are just IPC conform. It would be interesting for the manufacturer to get some information, so that possible process steps can be checked.can be checked.Up to now, the quality of this component has remained unchanged,However, should goods of a poorer quality be delivered,there is the possibility of real soldering defects (not soldered pins,displaced components) during production.Thank you very much for noticing and forwarding to the manufacturer TI.
Soldering profile: We use a vapor phase soldering system as the soldering system. Our reflow profiles conform to the parameters and classifications described in Table 5-2 Pb-free Assembly according to J-STD-020e. Our profiles do not reach more than 240C through vapor phase soldering (physically capped)."
--------------
Date Code: 2314
Lot Code: 3395797ML3
Mouser PO : 029-1K372
