TPS7A4501-SP: bottom thermal pad connection

Hey Erik,

Please refer to this E2E
https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1086020/tps7a4501-sp-thermal-via-connection-considerations/4020525?tisearch=e2e-sitesearch&keymatch=tps7a4501-sp%252520AND%252520thermal%252520pad#4020525

Thanks,
Daniel

Hi Daniel,

On my board, I was planning to thermal bond the thermal pad to CHASSIS ground.  The thermal expoxy is an electrical isolator.  However, the ground pins of the device are connected to the GND plane of my card.  CHASSIS and GND are electrically isolated on my card (there is a 1megahom resistor between them).  Is this acceptable?

CHASSIS and GND are tied together in one place in the box.  Just not on my card.

Hey Erik,

This would likely cause floating metal, which is up to your program on whether or not that is acceptable.

Thanks,
Daniel

Would it be better to solder a wire to case lid direct to GND?  This would make the electrical connection.  While the pad is thermally bonded to the CHASSIS layer.

Hey Erik,

This would connect the power pad/lid to ground.

Thanks,
Daniel

Hey Erik,

The part should perform well with that set-up.

Thanks,
Daniel