In the datasheet for the TPS272C45 (Table 6-1 and 10.4.1 Layout Guidelines), the recommendation for the external pad is to connect it to device ground for heat dissipation. Does this pad have any internal connection to ground? And if not, would it be possible to connect it to another signal (e.g., VS)? I have a potential application for this part where it would be advantageous to connect this pad to a large copper area that is not ground in order to get good heat dissipation, but this is obviously not possible if the pad is internally connected to the device ground or if a voltage on this pin will degrade device performance or break the part.
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