Hi team，
Can the temperature and humidity card be used for baking after it changes color as below ?Can this material be baked and used in this situation? What are the applicable baking conditions?
LDO REG. TPS74601PQWDRBRQ1 SON-8(3*3)//TI
D/C:2110
Thanks
Lillian
Hey Lilian,
I have not heard back from packaging, but I will re-ping them. I apologize for the delay.
To be clear, you want to know if you can bake the card and if you can use the parts after they have been baked?
If you just want to know whether or not the parts were exposed to moisture:
Card on the left was exposed, and card on the right was kept dry.
The device you chose has an MSL rating of Level-2-260C-1 YEAR with a max thickness of 1mm.
The level 2 indicator is still blue so it would not need to be baked.
This MSL ratings and reflow profiles white paper explains the levels and reflow temperatures.
AN-2029 Application report shows the baking profiles of the ICs if moisture has entered the package.
Best,
Juliette
