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TPS43060: Datasheet footprint/pin-layout confusion/mistake

Alex
Prodigy 10 points
Part Number: TPS43060


Hi,
I am a bit confused on how to interpret the datasheet of your TPS4306 boost converter w.r.t. the pin layout and the footprint recommendation (especially the thermal pad rotation).
Below a couple of pictures from your datasheet. Note that pin 1 is on the top left corner, and the rotation is counter clock-wise. The thermal pad is supposed to be vertical as in your recommended layout. However, looking at the actual chip and the bottom view on your datasheet, the thermal pad is supposed to be horizontal and not vertical. In the example board layout, the thermal pad is vertical, so pin 1 is supposed to be on the top-RIGHT corner in that picture in order to meet with the actual chip. In essence, something is clearly not really adding up in the information you provide in your datasheet. Can you get in dialogue with the responsible group to explain what information is correct, and what information is wrong?
  • 0
    TI__Genius 10385 points

    Hi Alex,

    Thank you for using E2E forums,  I will answer you next week.

    Thank you for your patience.

    BR,

    Haroon

  • 0 in reply to Haroon Wardak
    TI__Genius 10385 points

    Hi Alex,

    Thank you for using E2E forums, the first two pictures are top view and then the third is the bottom view hence you have that rotation or flip of the pin configuration.

    BR,

    Haroon

  • 0 in reply to Haroon Wardak
    Prodigy 10 points

    Hi Haroon,

    unfortunately, it still doesn't add up. I agree that the third picture is the bottom view. If you flip it upside down, pin 1 would be on the bottom left corner. The pin 1 indicator would also be on the bottom left corner, and the thermal pad is still vertical. You now rotate the IC 90 degrees clockwise in order to have the chip in the same rotation as in pictures 1 and 2.

    So after rotation, pin 1 is now on the left top corner (where pin 16 is shown in the third picture). But the thermal pad also rotates 90degrees, hence the thermal is now horizontal and not vertical anymore. And this is where there will be a mismatch with picture 2.

    TL;DR:

    The thermal pad in your datasheet does not match the actual chip.

    Please have a look at it based on my above description. Do you agree with my confusion?

    Thank you,

  • 0 in reply to Alex
    TI__Genius 10385 points

    Hi Alex,

    Oh ok you mean the thermal pad's orientation? let me have a look at the IC and come back to you.

    Please expect a response next week, due to my narrow bandwidth and also national holidays this week in Germany.

    Thank you for your understanding.

    BR,

    Haroon

  • 0 in reply to Haroon Wardak
    Prodigy 10 points

    Hi Haroon,

    exactly. I'm talking about the Thermal pad orientation.

    Enjoy your holidays, looking forward to your response next week then.

    Cheers,

  • 0 in reply to Alex
    TI__Genius 10385 points

    Hi Alex,

    Thank you

    I will get back to you asap.

    BR,

    Haroon

  • 0 in reply to Haroon Wardak
    Prodigy 10 points

    Hi, any updates?

  • 0 in reply to Alex
    TI__Guru 67555 points

    Hello Alex,

    Sorry for the delay, I ordered some components and it seems that we need to update the datasheet. I hope to be able to come back with a definitive answer in a few days. I want to make sure that I am not overlooking anything.

    Best regards,
    Brigitte

  • 0 in reply to Brigitte
    TI__Guru 67555 points

    Hello Alex,

    The layout drawing is showing the thermal pad in the wrong orientation, as you already found out. With the next datasheet update we will update this drawing as well. The package drawings at the end of the datasheet give the exact information as this is our reference for production.

    Best regards,
    Brigitte