TPS54160: Question about thermal pad size change.

Kazuya Nakai59

Guru 20670 points

Part Number: TPS54160

Hello guys,

One of my customers has been using TPS54160DGQ for their mass-production.

Recently, they received PCN of the device (PCN# 20230928002.1).
The PCN says that new assembly site, HFTF was added and qualified.
Also it says HFTF's package thermal pad size is bigger than the original package assembled at UTL/ASESH site.
At this moment, they have the following questions.
Could you please give me your reply?

Q1.
Are PCB land pattern and solder mask opening size needed to change due to new assembly site package addition?
If the answer is yes. could you please tell me the recommended size?

Q2.
If the answer to Q1 is No, is it no problem to solder though the additional package thermal pad size is larger than solder mask opening size?

Your reply would be much appreciated.

Best regards,
Kazuya.

11 months ago

0 Aurora Tie 11 months ago

TI__Genius 11290 points

Hi Kazuya,

The thermal pad size is 1.65mm*2.4mm. If the soldering part is small, it may affect the heat dissipation of the device. Thanks.

Aurora

0 Kazuya Nakai59 11 months ago in reply to Aurora Tie

Guru 20670 points

Hi Aurora,

Thank you very much for your reply.

I understood what you said.

Assembly wise, Is it no problem when PCB land pattern and solder mask are no changed?

Thank you again and best regards,
Kazuya.

0 Aurora Tie 11 months ago in reply to Kazuya Nakai59

TI__Genius 11290 points

Hi Kazuya,

I think this requires customers to actually evaluate the thermal. They can first make a few samples to evaluate the thermal of the chip under their working conditions. If there are no problems, I think there is no need to change it. Thanks.

Aurora

0 Kazuya Nakai59 11 months ago in reply to Aurora Tie

Guru 20670 points

Hi Aurora,

Thank you very much for your reply.

Please let me confirm.
Does TI not have any dimensions data of example board layout for DGQ0010D(DGQ 10pin) package made at HFTF assembly site?

Thank you again and best regards,
Kazuya.

0 Aurora Tie 11 months ago in reply to Kazuya Nakai59

TI__Genius 11290 points

Hi Kazuya,

For the detail information of this package, pls refer to the datasheet.(page 55 to 57). Thanks.

Aurora

0 Kazuya Nakai59 11 months ago in reply to Aurora Tie

Guru 20670 points

Hi Aurora,

Thank you very much for your strong supports.

The additional package code is DGQ according to the PCN I attached.
So I think the package, foot pattern and stencil information are page 51~53 of the datasheet.
Is my understanding correct?

I will inform the customer that foot pattern and stencil information on page 52~53 of the datasheet can be applied to the additional package which assembled at HFTF site if heat dissipation is not problem.

Is it OK?

Thank you again and best regards,
Kazuya.

PCN20230928002_202309281835391106.pdf

0 Aurora Tie 11 months ago in reply to Kazuya Nakai59

TI__Genius 11290 points

Hi Kazuya,

You are correct. Thanks.

Aurora

0 Kazuya Nakai59 11 months ago in reply to Aurora Tie

Guru 20670 points

Hi Aurora,

Thank you very much for your reply.
I could inform them that the foot pattern and stencil information on page 52~53 of TPS54160 can be applied to the additional package because of your supports.

Thank you very much again and best regards,
Kazuya.

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TPS54160: Question about thermal pad size change.