UCC27444-Q1: Layout about Thermal pad

Marc Liu

Expert 3210 points

Part Number: UCC27444-Q1

Hi Team,

From datasheet page 29, it doesn't show thermal pad, but the real product has.

Could you help double check if the thermal pad is contacted to GND or not ? And help update the datasheet.

Thank you!

Marc

over 1 year ago

+1 Alexander Mazany over 1 year ago

TI__Genius 11770 points

Hi Marc,

The part is currently released in the D package, which has no thermal pad. There is also a DGN version mentioned in the datasheet, which does have a thermal pad. Currently, only the D package version is released for purchase. Once the DGN is released, those package pages at the end of the datasheet should automatically update.

The pad is explained on the pinout section of the datasheet. It should be connected to GND, but it isn't a low-impedance path to GND (so you can't skip routing the GND pin).

Thanks,

Alex M.

0 Marc Liu over 1 year ago in reply to Alexander Mazany

TI__Expert 3210 points

Hi Alex,

Thanks for the reply! When will UCC27444QDGNRQ1 be released on TI.com?

Thank you!

Marc

0 Alexander Mazany over 1 year ago in reply to Marc Liu

TI__Genius 11770 points

Hi Marc,

I don't have access to that information. Most likely within the next month, but there is no guarantee.

Thanks,

Alex M.

Power management

Power management forum

UCC27444-Q1: Layout about Thermal pad