Is R_thetaJC in 5.2 measured at the case top or case bottom (i.e., thermal pad)
Thank you in advance, Kurt
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Is R_thetaJC in 5.2 measured at the case top or case bottom (i.e., thermal pad)
Thank you in advance, Kurt
Hello Kurt,
Thanks for the inquiry. RθJC is measured at the thermal (drain) pad on the bottom side of the package. TI does not spec RθJC(top) in the datasheet. Based on the die size and copper clip package, I'd estimate RθJC(top) is 15 - 20°C/W. Please see the blog at the link below for more information on how TI tests and specs thermal resistance.
Thanks,
John Wallace
TI FET Applications