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Hi,
Welcome to E2E!
Your observation is correct. During hot-plug, there will be huge ringing on the VIN and can exceed the abs max rating of eFuse.
Please place 100nF and TVS diode SMCJ24A-TR at the input and test again.
BR,
Rakesh
We also have a TPS25980EVM board that we were testing as well. I modified the board, replacing the TPS259804ONRGET with the TPS259807ONRGER and adjusting the resistor divider on EN/UVLO to handle a higher voltage input.
I then started removing protection components from the EVM board and testing hot plug performance until I got a failure. I removed one component at a time and tested the board with 20-30 hot plug events on each component removal. The components were removed in the following order:
D2, C3, D1, Q1, C2
It was the removal of C2 that finally killed it. The TPS part was ruined on the 2nd hot plug event after removing C2.
I'm just trying to understand if diodes and caps are necessary on input, output or both.
Hi,
C1 and D1 will play major role in handling the hot-plug transients. C2 does not impact the performance.
Can you capture Vin, Vout with respect to device ground and share the results to analyze the issue.
Best Regards,
Rakesh