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BQ24090: Thermal Consideration on the Linear Charger IC

Part Number: BQ24090

Dear TI Experts and Guru,

  We have a bunch of questions here on thermal consideration of BQ24090. Please bear with me for a few minutes.

  Q1:  RθJA  in thermal infomation and dissipation ratings of datasheet has two different values, 71.2°C/W and 52°C/W. What are the distinction between them?

Q2: Forgive me if I am asking a stupid question, for the statement as follow in Section 12.3:

"Due to the charge profile of Li-ion and Li-pol batteries the maximum power dissipation is typically seen at the
beginning of the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack
voltage increases to ≉3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes
a few minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum
voltage to use. "

Can I understand the above methodolgy as follow: As the threshold of precharge to fast charge is about 2.6V. The voltage drop is 5V-2.6V = 2.4V. However, the time it takes for battery to charge from 2.6V to 3.4V is typically within 2mins.  Considering thermal time constant, we should instead use 5V-3.4V = 1.6V to calculate the max power dissipation for more precise evaluation. e.g. for 270mA charge current, we get 1.6V x270mA = 0.432W, and it times RθJA  would lead to the temperature rise.  Please point out if I am wrong anywhere.

And where do we get the thermal time constant of the assembly? Please help to point out.

Q3: Could someone shed some light on the second part? What does IBAT mean here?( Is it something like ground pin current?) What's the relationship between Vout and VBAT(How do we distinguish them)?

Thanks in advance. Would really appreciate your help. Please kindly point out if anything unclear here.

Regards,

Yuanchen

  • Hey Yuanchen,

    I am working on answering your questions, and I should have an answer to you by tomorrow.

    V/R

    Rafael Camarillo

  • Hi Yuanchen

    Q1 - The two tables are different test boards. 8.5 is a  traditional board JEDEC High-K board while 8.5 is newer test methods IC Package Thermal Metrics, SPRA953.   This value is highly dependent on the PCB construction, copper area thickness, vias, temp and other factors.

    Q2 - As a general rule the greater the voltage drop across the device higher the power dissipation, start of fast charge. In your application you are describing a quick transition from 2.6V to 3.4V range, with higher power dissipation above this point.  We do have EVMs that could be used to evaluate your application, BQ24090EVM

    Q3 - The equation ( equation 2 from page 29) is a generic equation that could be used for non-power path (BQ24090) or power path devices (BQ2407X).  In the case of a power path device we have system current (IOUT) and battery current (IBAT).  While for a non-power path device the system and battery current are the same (IOUT).  With all terms on the 2ed part of equation 0 (right of + sign) it reduces to only 1st part of equation.  P = (Vin-Vout) X Iout