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UCC21530: Solderability Test Report

Part Number: UCC21530

Customer is asking for a test result of the Mechanical Stress Test for the device strength during mounting and assembly proccessing.

Not sure if the standard is referring to "J-STD-002" or not? Could you kindly help to offer it



  • Hi Brian,

    There is package-level testing done to verify that the force applied by the pick-and-place nozzle during mounting from reel to PCB does not damage the chip, but this information is mostly used for package versions with a thermal pad.

    There are also tests for force when a heat sink is screwed on to the PCB.

    What is the test condition that your customer is looking for? For example, what direction the force is applied and for how long, and how often this amount of force is applied. I might be able to find information general to an SOIC package.

    Can you clarify?

    Best regards,