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LMQ61460-Q1: Thermal Simulation results in EVB & Simulation

manoj kumatr
Prodigy 160 points
Part Number: LMQ61460-Q1

Dear Team,

We are doing the Thermal simulation for the LMQ61460AAS with below spec, and seeing the case temperature is 230deg. we are not sure that, this could be right one we r looking at, could you pls nconfirm on this?

 

PD = 1.02W

TA = 70deg

Simulated results: 235Deg TC

According to calculation:

TJ=1.02*59+70= ~130deg and if the TJ is 130deg case would less that this as per my understanding.

Also I can see in EVB doc that TEMP of CASE is around 76deg. and a note says TA can go upto 85Deg. Pls allobrate on this. also kinldy simulated resultys in the Ti WEBENCH TJ is 92.83deg c. can pls confirm me that  this will be tested, by placing the EVB at Hot plate at 70deg?

Many thanks in Advance !!

-Manoj.

  • 0
    TI__Guru 50120 points

    Hello,

    The 59C/W is JEDEC value that doesn't fully represent the device's thermal capability. 

    It is good as a way to compare between different device packages as a preliminary evaluation, but it is more imperative to use the (psiJT) number.

    You can refer to Section 2.2 in the app note below to understand why the RthetaJC value used for system level thermal calculation may not be representative of the actual thermal performance of the device. 

    App note: https://www.ti.com/lit/an/spra953c/spra953c.pdf

    Regards,

    Jimmy