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Thank you for your response. However, this is very urgent and necessary information, so I would like to ask you to provide it early. Thank you for your consideration.
I heard back much quicker than expected from the packaging team. Here is their response:
"TI follows JEDEC spec for MO-153 package standoff of 0.05-0.15mm. TI suggests customers to fabricate the stencil with 0.125mm thickness. With 0.125mm thick stencil there should be no issue to have the component thermal pad solder onto the PCB."
Thank you for your response. I understand that it is JEDEC compliant, but I would like to know the actual value. Could you please provide us with the following information? ・Variation in standoffs ・Process Capability Index (Cpk)
We typically cannot provide Cpk values or things of that nature as that offers insight into our proprietary design processes. Even still, I'll reach out to packaging again to obtain their reply.
