LP2998: About Package Outline of Datasheet

shimamura.tomoyuki

Prodigy 190 points

Part Number: LP2998

Hello,

There are three package outline figures, DDA008A, DDA008B, and DDA008D on its datasheet.

Can you explain the differences among them.

We would like to know the package outline of LP2998MRX/NOPB.

Thank you

over 1 year ago

0 Matt Sunna over 1 year ago

TI__Guru* 80964 points

Hi,

This device is manufactured at different sites which is the reason for the different package drawings. The only difference between these is the size of the thermal pad. If you use one of these, it should be compatible with the others.

Best regards,

Matt

0 shimamura.tomoyuki over 1 year ago in reply to Matt Sunna

Prodigy 190 points

Matt-san,

Thank you for your prompt reply.

Is there the way to know the manufacturring site from the package drawing on the datasheet?

Best regards,

Tomoyuki Shimamura

0 Matt Sunna over 1 year ago in reply to shimamura.tomoyuki

TI__Guru* 80964 points

Hi,

For the LP2998MRX/NOPB, I did some more checking into the manufacturing flows and all come from the same factory and use DDA0008A.

Best regards,

Matt

0 shimamura.tomoyuki over 1 year ago in reply to Matt Sunna

Prodigy 190 points

Matt-san,

Thank you for your prompt reply.

I understood that TI Melaka, which uses DDA0008A, is the only assembly site for LP2998MRX/NOPB.

Best regards,

Tomoyuki Shimamura

0 shimamura.tomoyuki over 1 year ago in reply to Matt Sunna

Prodigy 190 points

Matt-san,

There is another quetion from our customer.

Our customer recognizes only DDA008A for the package of LP2998MRX/NOPB.
Thay have asked us if there is any plan to issue PCN for adding packages of DDA008B and DDA008D?
If not, they need the reason why PCN is not issued.

Best regards,

Tomoyuki

0 Matt Sunna over 1 year ago in reply to shimamura.tomoyuki

TI__Guru* 80964 points

Hi Tomoyuki,

A PCN should be issued if additional assembly sites are added. There is no plan at this time.

Best regards,

Matt

0 shimamura.tomoyuki over 1 year ago in reply to Matt Sunna

Prodigy 190 points

Hi Matt-san,

Thank you for your reply.

I have checked PCN20211216002.1, which is for qualification of TI Mexico as an alternate assembly site.

Package change is not mentioned in this PCN.

Since the size of thermal pad is different, should it be mentioned in the PCN?

Best regards,

Tomoyuki

0 Matt Sunna over 1 year ago in reply to shimamura.tomoyuki

TI__Guru* 80964 points

Hi Tomoyuki,

If the DDA008A footprint is used, it should also work for the other package drawing options. Like I said, it looks like only DDA008A is shipping right now for this specific part number. You can check with your sales team if more information is needed, as I have limited visibility into the material sourcing details.

Best regards,

Matt

0 shimamura.tomoyuki over 1 year ago in reply to Matt Sunna

Prodigy 190 points

Hi-Matt-san,

Thank you for your reply.

I will check with our sales team if needed.

Best regards,

Tomoyuki

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LP2998: About Package Outline of Datasheet