LM2696: LM2696MXA Junction-to-Case thermal resistance

D B

Prodigy 20 points

Part Number: LM2696

Hello,

Do you have any information on the Junction-to-Case thermal resistance figure for the LM2696MXA component please?

I have checked the datasheet but can only find the Junction-to-Ambient figure.

Kind regards,

Dan

over 1 year ago

0 Frank De Stasi over 1 year ago

TI__Guru 65975 points

Hello

As a very crude approximation, you can use a value of θ_JA = 38°C/W.

Please see the attached application note for more information about estimating

the thermal performance of your design.

Also, please follow all of the recommended PCB layout guidelines in the data sheet.

Thanks

1401.snva951.pdf

0 D B over 1 year ago

Prodigy 20 points

Thanks for your reply.

Because of the HTSSOP package type (i,e. this component contains a large thermal pad to be soldered to the board) I was expecting a θJC figure much smaller than 38°C/W actually. I find sometimes this data may have been measured or calculated by manufacturers but not always included in the datasheets, I wonder if perhaps this data has been measured previously?

If any more accuracy for this component could be found, I would really appreciate it. I am running a thermal analysis model and this component is close to it's temperature limits.

Kind regards

Dan

+1 Frank De Stasi over 1 year ago in reply to D B

TI__Guru 65975 points

Hello

The θ_JA = 38°C/W. The θ_JC is about 5°C/W

Thanks

0 D B over 1 year ago in reply to Frank De Stasi

Prodigy 20 points

Hi Frank,

Great stuff! Thank you very much for this data, it is appreciated

Kind regards

Dan

Power management

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LM2696: LM2696MXA Junction-to-Case thermal resistance