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LM2696: LM2696MXA Junction-to-Case thermal resistance

D B
Prodigy 20 points
Part Number: LM2696

Hello,

Do you have any information on the Junction-to-Case thermal resistance figure for the LM2696MXA component please?

I have checked the datasheet but can only find the Junction-to-Ambient figure.

Kind regards,

Dan

  • 0
    TI__Guru 65525 points

    Hello

    As a very crude approximation, you can use a value of θJA = 38°C/W.

    Please see the attached application note for more information about estimating

    the thermal performance of your design.

    Also, please follow all of the recommended PCB layout guidelines in the data sheet.

    Thanks

    1401.snva951.pdf

  • 0
    Prodigy 20 points

    Thanks for your reply.

    Because of the HTSSOP package type (i,e. this component contains a large thermal pad to be soldered to the board) I was expecting a θJC figure much smaller than 38°C/W actually. I find sometimes this data may have been measured or calculated by manufacturers but not always included in the datasheets, I wonder if perhaps this data has been measured previously?

    If any more accuracy for this component could be found, I would really appreciate it. I am running a thermal analysis model and this component is close to it's temperature limits.

    Kind regards

    Dan

  • +1 in reply to D B
    TI__Guru 65525 points

    Hello

    The θJA = 38°C/W.  The θJC is about 5°C/W

    Thanks

  • 0 in reply to Frank De Stasi
    Prodigy 20 points

    Hi Frank,

    Great stuff! Thank you very much for this data, it is appreciated

    Kind regards

    Dan