LMR36506-Q1: About the internal structure of HotRod PKG

R.Fukunaga

Expert 1385 points

Part Number: LMR36506-Q1

Hi all,

I would like to know the internal structure of Flip-chip IC.

I think there is a difference with wire bonding IC as shown in the following image.

Benefits of flip chip on leadframe packaging for motor-drive applications

I think the wire bonding IC is connected by a gold wire.

How is the silicon connected to the die of the flip chip IC?

I would like to know about the internal structural strength.

Best Regards,

Ryusuke

8 months ago

0 Richard Fu22 8 months ago

TI__Mastermind 22200 points

Hi Ryusuke,

Flip chip technology is mostly about connecting the package to the die. The way it works is that it flips the IC upside down and connecting it via copper posts that attach to the top metal layer of the die. The benefit of this is that it can reduce interconnection inductance and resistance due to the removal of the bond-wires. It also allows for a smaller package, and higher interconnect density.

Thanks,

Richard

0 R.Fukunaga 8 months ago in reply to Richard Fu22

Expert 1385 points

Hi Richard

I'm sorry.

I didn't tell you exactly what I would like to hear.

Here are two things I want to hear.

1) How is the top metal layer of the die bonded/fixed to copper posts?

2) Is there a difference in the strength of the connection compared to bond-wires?

It would be helpful if you could give me some information.

Best Regards,

Ryusuke

0 David Baba 8 months ago in reply to R.Fukunaga

TI__Mastermind 31130 points

Hello Ryusuke,

Sorry for the delay, we will respond to your additional questions, will provide update Monday, thanks.

+1 Richard Fu22 8 months ago in reply to R.Fukunaga

TI__Mastermind 22200 points

Hi Ryusuke,

For 1) The top metal layer of die bonded to copper posts via solder. Please see this thread for an additional drawing:

https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1107137/tlv62569-internal-connection-of-nc-pin/4103560#4103560

2) No, it should be similar. The main benefit of the Hotrod is reduced rds-on, smaller package, and reduced parasitics. You may check the powerpoint here. There is also a presentation of this material on Youtube. 8130.Automotive Hotrod and Wettable Flanks Packaging Advancements – Perry Tsao - recording - external.pptx

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LMR36506-Q1: About the internal structure of HotRod PKG