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TPS709: Thermal Pad Left Floating

Part Number: TPS709


For the TPS70933DRVR, would there be any sort of issue if the extra ground pad underneath the IC (for the DRV variant) were not connected to ground even if pin 3 (GND) is connected to GND?

Wondering if this would cause any performance issues?  The data sheet only suggests a change in thermal performance.

Thank you, Keith