TPS82130: Package Properties

Peter Cameron

Part Number: TPS82130

I am seeking package information so that I may perform a solder fatigue analysis on the TPS82130 part for a customer application. I need the package (SIL 8-Pin, SIL0008C) CTE, modulus, and dimensions (thickness mainly). If this is not known, I would need to know what materials are used in the package construction so as to create a model of it in the software we use (Ansys/Sherlock).

Many Thanks,

Peter Cameron

over 1 year ago

0 Aurora Tie over 1 year ago

TI__Genius 14390 points

Hi Peter,

Sorry for the late reply. For your question, I need to contact our substrate vendor to check this. Their answer is shown below:

Total thickness is 200um.

Hope this can help. Pls feel free to let me know if you have any other questions. Thanks.

Aurora

0 Peter Cameron over 1 year ago in reply to Aurora Tie

Prodigy 10 points

Thanks Aurora, this appears to be a BT-epoxy laminate style of substrate based on the numbers. Do you have any information on the inductor? Is it expected to influence the properties given for the substrate. If there is an embedded device similar to the MicroSIP package, will that also have an influence?

0 Aurora Tie over 1 year ago in reply to Peter Cameron

TI__Genius 14390 points

Hi Peter,

I'm sorry the detailed structure material information is confidential and we cannot share this with you. Hope you can understand. Thanks

Aurora

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TPS82130: Package Properties