TPS65132: spec check

GARETH OU

Part Number: TPS65132

1.The TPS65132SYFFR chip uses a fixed output of ±5.4V and does not require I2C to adjust the voltage. Do the two I2C signal lines need to be processed? Can be left floating

2.D2 pin (AGND) is in the middle, with a 4mil line width, and a 4mil spacing between adjacent lines. Is it feasible?

6 months ago

0 Patrick Yao 6 months ago

TI__Mastermind 25530 points

Hi GARETH,

1. Unused SCL and SDA are recommended to be pulled up.

2. Could you use the vias to connect AGND to internal ground plane directly? Wire will introduce some parasitic inductance.

Patrick

0 GARETH OU 6 months ago in reply to Patrick Yao

Mastermind 9765 points

Hi Patrick

Non-HDI PCB cannot be blindly buried. Please help evaluate.

0 Patrick Yao 6 months ago in reply to GARETH OU

TI__Mastermind 25530 points

Hi GARETH,

It is ok for this connection; I don't think it will introduce large impact. But I still recommend either direct vias or blindly buried vias to connect the AGND to GND.

Patrick

+1 GARETH OU 5 months ago in reply to Patrick Yao

Mastermind 9765 points

Hi Patrick

Got,it ,thanks

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TPS65132: spec check