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BQ79616: How to optimize control BQ79616 with MCU?

Nazli Soyturk
Prodigy 105 points
Part Number: BQ79616
Other Parts Discussed in Thread: TMS570LS3137, TMS570LS1224

Hello,

In the user guide, it is mentioned that connecting the BQ79616s in a daisy-chain stack structure allows them to be controlled by the MCU through the bridge device BQ79616. This will establish a BMS (Battery Management System) system.

 

There are two different designs to control the number of devices on the right side of the image above:

a) Control with MCU between 3-4 devices.
b) Control with MCU up to 30 devices.

What are the advantages and disadvantages of these two options? When choosing an MCU, what factors should be considered in the given options?

  • +1
    TI__Expert 5880 points

    Hi Nazli,

    The main determining factor of how many devices needed is how many cells does your battery pack application need to monitor? another factor is how are the batteries needing to be placed? For example, maybe you have 48 cells. As the BQ79616 monitors 16 cells, it is possible to use 3 to monitor 16 cells per IC, but maybe the customer would like two ICs on one side of the application and two ICs on the other side of the application. This would be 4 monitors to monitor 12 cells. Location depends on what requirements the customer has.

    In terms of choosing an MCU, if the customer is communicating with a BQ79600, then the customer can communicate with either 3.3V/5V UART at 1MBps or 3.3V/5V SPI at 2 to 6 MBps. If the customer would like to communicate to the BQ79616 directly, then the customer can communicate with 5V UART. If the MCU RX/TX pins only go up to 3.3V, then the customer can use an isolator between the MCU and 616 to convert the MCU's 3.3V to the 616's 5V CVDD pin voltage.

    Regards,

    David

  • 0 in reply to David Ray
    Prodigy 105 points

    Hello David,

    I wanted to give you an update on the battery pack design. We will be monitoring a maximum of 400-430 cells with 30 or 35 BQ79616s each monitoring 14 or 16 cells per IC. We are considering using TMS570LS1224 or TMS570LS3137 processors from the Hercules family to control ICs that will be connected in a daisy chain structure to support fast communication to ensure high performance and security. However, since stock problems may affect production, we are open to alternative processor suggestions.

    Please let me know if you have any thoughts or concerns about this.

    Regards,

    Nazli

  • +1 in reply to Nazli Soyturk
    TI__Expert 5880 points

    Hi Nazli,

    We would recommend the AM263X which is the next generation MCU our team is moving forward to.

    The AM263X EVM: TMDSCNCD263 Evaluation board | TI.com

    The AM263X daughter card: https://www.ti.com/tool/TMDSHSECDOCK

    Regards,

    David