Hello team,
My customer is in need of information on the UBM (Under Ball Metallization)/SRO (Solder Resist Opening) of this device TPS62801YKAR.
Thank you,
Austin Allen
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Hello team,
My customer is in need of information on the UBM (Under Ball Metallization)/SRO (Solder Resist Opening) of this device TPS62801YKAR.
Thank you,
Austin Allen
Hello Austin,
Let me check this internally and get back to you.
Thank you & regards,
Moheddin.
Hello Austin,
As far as I can see from the MQ of this device, the average bump diameter under the ball is 220um, hope this helps.
Thank you & regards,
Moheddin.