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TPS7B7702-Q1: thermal resistance

Part Number: TPS7B7702-Q1

Thermal resistance

Hi team,

The TPS7B7701/7702 data sheet lists a Junction-to-ambient thermal resistance(Rθja) of 45.9deg/W, 40.3deg/W.

Those package is same, but thermal resistance is not same.

What is the reason for the change in resistance?

regards,

  • Hi,

    The effective thermal resistance depends on the package, die attach, size of the die, and board layout. The single-channel device has a smaller die (since the pass FET is about half the size of an LDO's die area), which means there is less die attach between the die and the package, so this is likely the reason for the worse thermal metrics for the single-channel device. 

    Regards,

    Nick