• State TI Thinks Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 1 answer
  • Subscribers 64 subscribers
  • Views 330 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS5430: TPS5420 and TPS5430 change notice

chris summit
Prodigy 110 points
Part Number: TPS5430
Other Parts Discussed in Thread: TPS5420,

Hi, 

I received a change notice for TPS5420 and TPS5430 from my local distributor.  Most of the changes appear to be simply datasheet verbiage or improvements to ratings, IE lower operating current, lower RDS etc. There were two changes however that I was unsure about. 

The first change is in the thermal characteristics for both the TPS5420 and 5430. I believe that is only due to the fact that you are now using your EVAL board as opposed to some generic test board that is called out in the original datasheet. Is that correct? From the parts point of view, there is no actual thermal change to the part that would affect the thermal performance, correct?

 I also see there is an ESD rating for the 5430 that went down to +750V from +1500V. Why is that?  Is the part more susceptible to ESD during assembly now that it is only rated to 750V. For the 5420 this rating was never called out, but I assume it went down as well as now it is listed as 750. 

In closing I have been using these two parts in a design now for about 10 years with no issues. In reviewing the changes, I really do not see anything that should be cause for alarm, but I do not want to miss anything either. From what I see, it appears that these changes are datasheet related rather than an actual physical design change to the part. Am I correct in this thought? 

 Thank you in advance for your time,

Chris 

  • 0
    TI__Expert 6245 points

    Hello Chris, 

    The latest datasheet is written to be compatible with an upcoming die shrink.  The new device has lower RDS to compensate for higher thermals caused by the smaller die.  These two changes together allow both devices to handle the same current when running.  Since the datasheet describes both devices, a few typical specifications are moved to the average of the two devices.  Minimums and maximums are specified as the worst case for both devices.   

    Since ESD for new devices is typically specified as 2000 V HBM and 750 V CDM these specifications are used.  Both old and new devices pass these tests.  Since the new device has not been tested to higher voltage, it is not known which device is more resistant to ESD. 

    Regards, Robert 

  • 0
    Prodigy 110 points

    Robert,

    Thanks for the explanation. So, with these changes, the part new should perform exactly as the old part did and should be a drop-in replacement, correct?  Will there be a way to identify the smaller die? How can I get samples of this to test? 

    Thanks,

    Chris