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BQ21040: Do the SNAGU solder balls on BQ25155YFPR become lower in height post reflow?

Bob Olson
Prodigy 10 points
Part Number: BQ21040

Tool/software:

Hi,

1st off, the Part number in the Part Number field is not the Part Number of interest.  Entering BQ2155YFPR was not being accepted.

I am a mechanical engineer working on a smart ring, and in some spaces even tens of microns get added into space calculations.  Is there a way to get some understanding of how a YFP Package would sit on an FPC's solder pads, post-reflow?  I could simply use the package height add in an estimate for solder thickness, but it seems like a solder ball will not only reduce in height, but also that being sperical that it won't simply "sit on top" of say a 50 micron solder thickness.  Any help is appreciated.  

And, yes, I am guessing this is the right place to ask!  Could easily need to be in a different forum, so, if that is the case, I'd like to know so I can direct this query appropriately.

Thanks,

Bob

  • 0
    TI__Genius 14395 points

    Hi Bob,

    I'll reach out to the package team to let you know what I find.

    Best Regards,

    Juan Ospina

  • 0 in reply to Juan Ospina
    TI__Genius 14395 points

    Hi Bob,

    It looks like ball height, and ultimately final package height, are very process dependent on the SMT method done and varies from application to application. Since this isn't really something controlled by TI it isn't something we can provide specs or drawings for. It's recommended that this be discussed with the board assembler. 

    Best Regards,

    Juan Ospina