Tool/software:
Hi,
1st off, the Part number in the Part Number field is not the Part Number of interest. Entering BQ2155YFPR was not being accepted.
I am a mechanical engineer working on a smart ring, and in some spaces even tens of microns get added into space calculations. Is there a way to get some understanding of how a YFP Package would sit on an FPC's solder pads, post-reflow? I could simply use the package height add in an estimate for solder thickness, but it seems like a solder ball will not only reduce in height, but also that being sperical that it won't simply "sit on top" of say a 50 micron solder thickness. Any help is appreciated.
And, yes, I am guessing this is the right place to ask! Could easily need to be in a different forum, so, if that is the case, I'd like to know so I can direct this query appropriately.
Thanks,
Bob
