TLV61070A: TLV61070A CIN GND LAYOUT.

kwon

Part Number: TLV61070A

Tool/software:

Hi~.

Ask how to connect Cin gnd and IC GND effectively for EMI.(TLV61070A)

1. Which is effective for emi, connecting directly to the IC GND pin as shown in "data sheet Figure 8-13" or connecting to GND copper as shown in "ek Figure 4-1"?

2. If CIN pin1 (VCC) position is the same,

1) If GND COPPER is closer than IC GND, is it effective for emi to connect to GND COPPER?

Thanks.

3 months ago

+1 Travis Wang 3 months ago

TI__Expert 4815 points

Hi Kwon,

1. Both connection will work. Data sheet Figure 8-13 has better performance but challenges clearance constraint.

2. Yes. It is less effective but still effective. The DM conductive flows like:

This is not sensitive to parasite inductance when you just add several nH parasite in serial with a 1uH L1.

Best Regards,

Travis

+1 kwon 3 months ago in reply to Travis Wang

Intellectual 850 points

Hi Travis,

Thank you for your support.

Best Regards.

KWON.

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TLV61070A: TLV61070A CIN GND LAYOUT.