CSD88599Q5DC: Datasheet info is missing on top package "EXPOSED HEAT SLUG"

Hi Brian,

Thanks again for your interest in TI FET products. The exposed heat slug on the topside of the package is internally connected to the source of the low side FET which is PGND. Please see Thermal Consideration in section 7.1.2 of the CSD88599Q5DC datasheet for information on heat sinking. There is no formal documentation for heat sinking but you can see some examples in the following TI reference designs:

TIDA-01485 uses a pin fin heat sink (Wakefield Vette pn 904-27-2-23-2-B-0) and thermal conductive pad (Laird Technologies pn A15727-00) as shown on page 28 of the design guide. More information can be found in the bill of materials.

TIDA-0074 was tested with a heat sink. I'll see if I can get you a part number.

Best Regards,

John Wallace

TI FET Applications

Correction: TIDA-00774 which used the CSD88584Q5DC (same package with lower voltage FETs).