Tool/software:
Dear team,
There is no output issue on TPS6521901 from customer. The customer think main cause is SMT fail like below image.
Below is soldering X-ray image of failed device. As you can see below, there are many void on power pad. After re-work, the device operate well.
- Is this the cause of the no output issue?
- If yes, At least how much soldering should be?
At datasheet, there is comment like below.
- 74% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
- Should I recommend that Min 74% be soldered without void on power pad?
If you have SMT guide including flow time, temp and etc for TPS65219 device, Please share the documents.
If there is no guide line for TPS65219, please share the document of SMT guide even for general QFN device.
Thank you.
Thank you.
