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LMG3522R030: Heat Sink Mechanical design

Brian Wang0928
Genius 12890 points
Part Number: LMG3522R030

Tool/software:

Customer is interested in TI's GaN. however they're worried about how to put the heat sink onto the GaN top side with suited mechanical pressure and material interfacing.

Not only pressure on the power element, but also use of torque, or the compression ratio of the heat spreader are important related to the capability of the manufacturing in customer, etc.

Is there regulation or guideline?Very thanks. 

  • +1
    TI__Intellectual 2980 points

    Hello,

    Here is a Seismic link for an application note specifically for thermal design considerations with our top-side cooled devices:

    Application Report

    It details the high-level design rational for these parts, however, some of you fabrication specific questions may need to be asked directly to the manufacturer.

    Let me know if this helps,

    Zach Soviero