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UCC27282EVM-335: UCC27282EVM-335

John Babico
Prodigy 10 points
Part Number: UCC27282EVM-335
Other Parts Discussed in Thread: UCC27282, , LMG1205, LMG1210

Tool/software:

Using this eval board, it seems that the thermal pad on UCC27282 chip which is thermally connected to a large GND plane is not enough to dissipate the heat created within the chip. I have to use an external fan to keep the chip cooler. I have damaged the 1st eval board without providing air flow for the chip. This chip is driving 2 MOSFETs IRF510 whose output is connected to a 1:9 transformer, low pass filter, and 50 ohm load. Switching frequency is 7MHz. I use the EN input to pulse the RF with a 40% duty cycle.

Do you think I need to provide better heatsinking to UCC27282 and how?

Thanks

  • 0
    TI__Genius 12745 points

    Hey John,

    Thank you for reaching out to TI with your questions regarding the UCC27282.

    The UCC27282EVM-335 is designed for testing characteristics of the driver and isn't a power stage in itself. But, looking at your application, you may be exceeding the thermal restrictions of the driver. Please take a look at this FAQ regarding maximum operating frequency.

    [FAQ] UCC27282: How to Calculate the Max Operating Frequency of a Half-bridge Gate Driver

    For 7MHz switching frequency, if you are not able to manage the thermals of the UCC27282, you may want to look into a GaN power stage with the LMG1205 or the LMG1210.

    Let me know if there are any further questions.

    Thank you,

    William Moore

  • 0 in reply to William Moore
    Prodigy 10 points

    Thank you so much William for your quick response and for the spreadsheet calculations.

    I believe the 7MHz is manageable because I can use MOSFETs with low Qg. I still like to add some sort of heatsinking to this chip for better reliability.

    Would you suggest how to add a heatsink to this package? Do you think TI might offer this chip in a different package with much lower thermal resistance, in the near future?

    Regards,

    John

  • 0 in reply to John Babico
    TI__Genius 12745 points

    Hey John,

    I have not added a heatsink to the gate driver before but from some searching, an example part number from Fischer Elektronik is the ICK SMD A 8 SA. When attaching to the driver there are thermally conductive epoxies and 3M makes a thermally conductive tape. When doing this, I would be careful that the heatsink does not come into close proximity of the high-voltage pins on the gate driver.

    As for a driver with lower thermal resistance, the DRC package that the UCC27282 comes in is one of our lowest thermally resistive options and so we there may not be many better options in the future for lower thermal resistance.

    Thank you,

    William Moore

  • 0 in reply to William Moore
    Prodigy 10 points

    Thanks again William for your super quick response and suggestion.

    Take care.

  • 0 in reply to John Babico
    TI__Genius 12745 points

    Hey John,

    You're welcome! Let us know if you have any further questions.

    Thank you,

    William Moore