LMR33630AP-Q1: Package outline in datasheet

Muwei Zheng

Part Number: LMR33630AP-Q1

Tool/software:

Hi team,

Could you please clarify, which package shall we use for a footprint for LMR33630APCQRNXRQ1. In datasheet I see two package options: RNX0012B and RNX0012C under the same part number.

They have different pin’s flank and therefore solder mask opening.

Thank you,

Muwei Zheng

7 months ago

0 Joshua Austria 7 months ago

TI__Genius 17075 points

Hi Muwei,

I will ask the team and try to get back to you by EOD tomorrow.

Thank you for your patience,

Joshua Austria

0 Muwei Zheng 7 months ago in reply to Joshua Austria

TI__Intellectual 1390 points

Hi Joshua could you provide any update here?

0 Joshua Austria 7 months ago in reply to Muwei Zheng

TI__Genius 17075 points

Hi Muwei,

Unfortunately, there have been some delays, I will push to get an answer for you soon.

Thank you for your patience,

Joshua Austria

+1 Joshua Austria 7 months ago in reply to Joshua Austria

TI__Genius 17075 points

Hi Muwei,

Per the team:

"For the LMR33630APCQRNXRQ1, the package drawing should be RNX0012C.

If they look at the bottom of the package on the pads, they will the dimples."

Hope this answers your question,

Joshua Austria

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LMR33630AP-Q1: Package outline in datasheet