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UC2845AQ: Device query

Shinu.V.Mathew
Expert 8995 points
Part Number: UC2845AQ
Other Parts Discussed in Thread: UC1845, , UC1845A-EP

Tool/software:

Hi Team,

UC2845AQ  is rated for 125 Deg but here thermal resistance is higher than UC1845 CDIP and LCC package, How’s that possible?

Also UC1845A-EP is rated for 125 Deg C in SO8 package where thermal resistance is higher than DIP and LCC package.

Can you please share your inputs,

Regards, S Mathew. 

  • 0
    TI__Mastermind 31565 points

    CDIP and LCC are thermally enhanced packages with lower thermal resistance compared to D pkg. Lower thermal resistance means lower temp rise for the same power dissipation, same operating conditions. Think about the fine pins width/weight of SOIC package (SMD) as a heatsink vs the wider, heavier pins of a PDIP package (through-hole) and it makes sense that the PDIP would have lower thermal resistance (better thermal conductivity) compared to SOIC. The ceramic packages used in EP devices are further enhanced for even better thermal conductivity→lower thermal resistance→lower junction temp rise.

    Steve