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BQ24610: Inquiry on heat generation problem of ACFET P-channel power MOSFET in BQ24610 circuit

Part Number: BQ24610

Tool/software:

Hi, TI expert

The customer applied BQ24610 and made a board and tested it, but there is a heat generation issue in ACFET P-channel power MOSFET.

The review contents are as follows.

1. BQ24610 EVM circuit was used.

- Below is the circuit diagram. Please refer to it. ( ACFET_Q2 : This is SI4401BDY-T1 (VISHAY) used in BQ24610EVM.)

2. Electrical specifications

- Input: 24V / Max. 10A

- Load: 24V / Max. 6.5A

3. Problem: When 24V/6.5A load is applied to V-SYS at room temperature (25℃), the temperature of ACFET (Q2_SI4401BDY) component exceeds 75℃.

Question 1) Will the heat generation of ACFET (Q2_SI4401BDY) component be reduced if R24, R21 value is reduced or 0 ohm is processed?

Question 2) The component specifications of Q1 and Q2 are sufficient for the maximum 10.5A, but should I increase the capacity further?

Question 3) Is there a way to lower the temperature of the ACFET (Q2_SI4401BDY) component to below 65℃?

Please check. Thanks

  • Hello Grady,

    This looks to be related to the layout. I recommend following our layout guidelines:3324.Layout Guidelines and Example.pdf

    Best Regards,

    Christian.

  • Hi, Christian

    Thank for response.

    Is there any answer to Question 1 and Question 2 above?

    The customer said that they reflected the layout guide contents in the datasheet and EVM as much as possible, but do you think the layout is the main cause?

    If so, can you review the PCB layout if the customer wants? (If possible, please let me know the necessary data.)

    In addition, if I test with the BQ24610EVM under the same conditions, will it not overheat?

    Thanks

  • Hello Grady,

    Question 1) Will the heat generation of ACFET (Q2_SI4401BDY) component be reduced if R24, R21 value is reduced or 0 ohm is processed?

    This resistor is not required, so you can reduce it, however I don't think it will resolve the issue. I don't see any issue in checking to see if it works.

    Question 2) The component specifications of Q1 and Q2 are sufficient for the maximum 10.5A, but should I increase the capacity further?

    Yes, This should help.

    If so, can you review the PCB layout if the customer wants? (If possible, please let me know the necessary data.)

    I would recommend changing the FETS first.

    Best Regards,

    Christian