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CSD87313DMS: WSON Lead Positioning

David Scheftic
Prodigy 50 points
Part Number: CSD87313DMS

Tool/software:

Good evening. using the CSD87313DMS as an example for a packaging example WSON-CLIP.  This is not so much a Power management forum question as it is a packaging question.

I am interested to know about packaging tolerances on WSON or SON, OR DFN...types of packaging as per the attached drawing.

  • 0
    TI__Mastermind 37950 points

    Hello David,

    Thanks for your interest in TI FETs. I have shared this with our SMT expert to get his inputs. I will update you as soon as I have more information.

    Best Regards,

    John Wallace

    TI FET Applications

  • 0 in reply to John Wallace1
    TI__Mastermind 37950 points

    Hi David,

    I've received the response below from our SMT expert. I have asked him to provide tolerances and to give his input on your questions about the position of the solderable pads in relation to A & B. I will update you as soon as I have the information you requested.

    Thanks,

    John

    From TI SMT expert:

    A : 0.5mm

    B : 0.335mm

    C : 0.94mm

    D : 0.2mm

  • 0 in reply to John Wallace1
    Prodigy 50 points

    Thank you John. This is helpful.  My theory is that the lead frame holds a very tight position on the location of the lead frame pads based on the required tolerance for die attach, wire bonding and encapsulation associated with the multi-part lead frame design. Those lead frame pads cannot move any significant amount...is my thought.  I suspect the A and B dimensions are more related to the lead frame pattern manufacturing process accuracy. The larger tolerance on the size of the lead frame pads is more about saw accuracy to dice up the parts to detach from the overall lead frame. 

    I appreciate the quick responses.

  • 0 in reply to David Scheftic
    TI__Mastermind 37950 points

    Hi David,

    Apologies for the delay. I confirmed with the packaging team that the tolerance on the A & B dimensions is +/-0.1mm. I've got no additional information to share at this time.

    Best Regards,

    John